1.Applicable to IP/Android mobile phones, laptop, desktop computer CPU/graphics card processors, various modules with high thermal conductivity requirements, high-speed large storage drives, network communication equipment, cooling devices, electronic components, office software equipment, household appliances Waiting for the maintenance and use of various devices.
2.Thermal conductivity 6.0W/MK, heat and humidity resistance, environmental aging resistance, easily cope with the heat brought by high power consumption CPU/GPU.
3.Has good insulation, non-conductive, and does not corrode various heat dissipation components.
4.Low deformability, good plasticity, low fluidity, compressible voids.
| الوزن | 0.04 كيلوجرام |
|---|
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